多芯片组件倒装焊焊点三维形态预测研究 |
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| [摘要] |
| 基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。通过对预测结果进行数据分析与处理，建立了钎料体积和预定间隙与焊点高度之间的预测关系表达式。 |
| [英文摘要] |
| Based on minimal energy principle,Evolving model of flip-chip 3-D shape prediction of MCM is established,and 3-D solder shape is effectively predicted.After that,the relationship between the process parameters(solder volume,gap height)and the solder height is established through data analysis and process. |
| [关键词] |
| 多芯片组件 倒装焊 焊点形态 建模 回归分析 |
| [作者] |
| 吴兆华 周德俭 潘开林 |
| [作者单位] |
| 桂林电子工业学院 |
| [刊名] |
| 电子工艺技术 |
| [英文刊名] |
| ELECTRONICS PROCESS TECHNOLOGY |
| [期刊类别] |
| 无线电电子学与电信技术 |
| [年 卷 期] |
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1999 20 2 点击免费下载论文：多芯片组件倒装焊焊点三维形态预测研究 |