SMD真空无钎剂激光软钎焊试验研究与机理分析 |
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| [摘要] |
| 无钎剂软钎焊技术可以从根本上解决因钎剂的副作用而带来的一系列问题。本文就真空无钎剂激光软钎焊可行性进行试验研究及真空的无钎剂作用机理分析，并将该技术成功地应用于片式电阻元件的表面组装中。 |
| [英文摘要] |
| Fluxless soldering can solve a series of problems caused by the side effect of flux essentially.The feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out.What"s more,this fluxless technology was applied in surface mounting of chip resistance successfully. |
| [关键词] |
| SMD 真空 无钎剂软钎焊 |
| [作者] |
| 韩鹏飞 谢孝秋 李明雨 王春青 冯武锋 |
| [作者单位] |
| 大庆毛纺集团公司 哈尔滨工业大学现代焊接生产技术国家重点实验室 |
| [刊名] |
| 电子工艺技术 |
| [英文刊名] |
| ELECTRONICS PROCESS TECHNOLOGY |
| [期刊类别] |
| 无线电电子学与电信技术 |
| [年 卷 期] |
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1999 20 1 点击免费下载论文：SMD真空无钎剂激光软钎焊试验研究与机理分析 |