电子接插件的快速连续电镀方法 |
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| [摘要] |
| 介绍了适于电子接插件的快速连续电镀金、钯及Sn-Pb合金工艺的流程、操作要领等，对镀层的性能进行了分析比较，提出了快速电镀应解决的问题。 |
| [英文摘要] |
| The processes and operating conditions of the fast continuous electroplating gold,palladium and Sn-Pb alloy for electronic connectors were introduced.The properties of gold coating and palladium coating were discussde.The problem for fast continuous plating was pointed out. |
| [关键词] |
| 电镀 电子接插件 镀金 镀钯 |
| [作者] |
| 马今朝 |
| [作者单位] |
| 黑龙江商学院电子系 |
| [刊名] |
| 电子工艺技术 |
| [英文刊名] |
| ELECTRONICS PROCESS TECHNOLOGY |
| [期刊类别] |
| 无线电电子学与电信技术 |
| [年 卷 期] |
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1999 20 1 点击免费下载论文：电子接插件的快速连续电镀方法 |